Printed circuit board (PCB) flatness analysis involves quantifying deviations from a perfectly flat plane. This assessment is typically performed using specialized equipment that measures the height of various points on the board’s surface and calculates parameters like warpage, twist, and overall flatness deviation. For instance, a measurement might reveal a specific board exhibiting 2 mm of warpage across its longest dimension.
Maintaining a high degree of flatness is crucial for successful PCB assembly. Excessive deviations can lead to difficulties in component placement, solder joint failures, and problems with automated optical inspection. Historically, flatness requirements have become more stringent with the increasing miniaturization and density of electronic components and the growing prevalence of surface mount technology (SMT). A flat PCB ensures proper contact during reflow soldering and prevents stress-induced failures in delicate components.
